bonding layer

The Distributed Force Model of Intelligent Beam Structures Based on Effect of Bonding Layer

考虑粘贴层影响的智能结构梁分布力模型

Two dimensional finite element analysis of ceramic veneer bonding layer

对瓷贴面粘结层的有限元应力分析

Experiment is divided into two phases, First, at high temperatures using high-titanium slag and graphite crucible wall reaction produce the bonding layer of Ti ( C, N), and investigated the influence of reaction time on Ti ( C, N) formation.

实验分为两个阶段进行。首先在高温下采用高钛渣与石墨坩埚壁反应生成Ti（C，N）粘结层，并考察反应时间对Ti（C，N）生成量的影响。

The capability variation rule of bonding layer was also analysed.

采用滑动磨损法检测了耐磨性，并分析了衬瓷层性能的变化规律。

Technique, such as electronic probe, XRD, optical microscope, micro-hardness and macro hardness test, are applied to investigate the microstructure, phase structure, and analyze the alloy element distribution of metallurgical bonding layer and the material mechanical property changes.

利用电子探针、XRD、光学显微镜、显微硬度和宏观硬度测试等手段，研究扩散件试样的显微组织、物相结构，分析冶金结合层中合金元素分布和材料内部力学性能变化。

TEM study of bonding layer in Cu-Al explosively welded joint

Cu－Al爆炸焊结合层的透射电镜研究

Results: Stress concentration areas of ceramic veneer bonding layer were regularly located on the incisal margin and cervical margin.

结果：瓷贴面粘结层应力主要集中于切端粘结点及颈部粘结点。

Through its two materials closely bonding layer, which is guaranteed to multilayer structure integrity.

通过它紧密粘接两种材料层, 即能保证多层材料的结构完整性.

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

It is shown that the effect of interphase thickness on thermal expansion of 3D-C/ SiC composites lies in its influence on interphase bonding strength and sliding resistance in the debonding layer.

结果表明：①界面相厚度对3DC/SiC复合材料热膨胀性能的影响主要归因于其对界面结合强度和脱黏面上的滑移阻力的影响。

Bonding mechanism of crosshead ductile iron surface and tin pewter layer

十字头球铁表面与锡锑轴承合金层结合机理

When incisal areas need to be altered, the incisal overlap or butt margin design will not cause any stress problem in the bonding layer.

在需切端重建的瓷贴面修复设计中无论包绕型设计或对接边缘设计对粘结层应力均无明显影响。

Research on Bonding Layer of Transfer Foil Operation

转印箔中粘接层的研究